Thermal conductive Sheet
BFG20 Series
One of Denka Product higher thermally conductive (low thermal resistance) material made of silicone highly filled with ceramic filler. This material can efficiently transfer heat from power transistors, driver ICs, etc., while at the same time ensuring insulation, making it ideal for thermal countermeasures in a variety of electronic devices. UAC has been supplying to many overseas manufacturing facilities since long time.
For detail product overview please click below link.